Laser cutting

ABSTRACT

Laser cutting systems and methods are described herein. One or more systems include a laser generating component, an optical component, a fixture for holding a support with a part positioned on the support, and a control mechanism for adjusting at least one of the laser generating component, the optical component, and the fixture such that a ratio of a laser energy applied to the part and a part material thickness is maintained within a predetermined acceptable range at each point along a cut path to cut through the part while maintaining the integrity of the support. Other systems and methods are disclosed herein.

PRIORITY INFORMATION

The present application is a continuation of U.S. application Ser. No.15/218,778, filed Jul. 25, 2016, which is a continuation of U.S. patentapplication Ser. No. 13/239,173, filed on Sep. 21, 2011, now U.S. Pat.No. 9,403,238, the contents of which are incorporated herein byreference.

TECHNICAL FIELD

The present disclosure relates to systems and methods for laser cutting.

BACKGROUND

Laser cutting systems have been devised and are utilized in manyindustries. For example, in the auto industry a laser cutting system isused to cut the edging on a bumper that is formed using a mold, stampingpress, or other forming tool.

Once formed, the bumper is removed from the mold, press, etc., but oftenincludes some extra material around the edges from the mold formationprocess. A laser cutting system can be used to remove this extramaterial from the bumper. Accordingly, the laser cuts the material offand the edge of the part is polished through hand polishing, or othersuch manners, to remove any sharp portions and generally smooth theedge.

In some other implementations, an item is formed on a mold and a laseris used to cut the item off of the mold. Alternatively, an item isformed on a mold by stamping or another forming process and the item ispositioned using a support of some kind. If the item has been molded,the mold may be used as the support. However, cutting into the supportmaterial can be detrimental to the process. For instance, the supportmaterial, when cut with the laser, may mix with the material used toform the item. This can cause unintended material physicalcharacteristics or discoloration, which may not be desirable.

The cutting process itself can also change the characteristics of thematerial near the cut path. Unlike other cutting techniques, lasercutting generates enough heat to cut the material and, as such, thematerial's interaction with the heat can change its characteristics, forexample, making it more brittle which can be undesirable in someapplications. This can be particularly true where the cut is to be madeat relatively high speed and therefore a high energy laser beam is usedto cut through the material quickly.

Additionally, the thickness of the material being cut can change in someimplementations and as such, the effectiveness of the cutting techniquecan be reduced. For example, if a portion of the material being cut isthicker than a portion used to calibrate the laser for most effectivecutting, the laser may not cut all the way through the material or thematerial may not be vaporized as effectively.

If the material is thinner, the characteristics of the edge of the cutmaterial may be changed in an unintended manner. The laser may also cutthrough the item being cut and into the support material which may beundesirable in some applications as discussed above.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 illustrates a system that can be used in accordance with one ormore embodiments of the present disclosure.

FIG. 2 illustrates a piece of part material being applied over a moldaccording to one or more embodiments of the present disclosure.

FIG. 3 illustrates a part being created by forming the piece of partmaterial over at least a portion of the surface of the mold according toone or more embodiments of the present disclosure.

FIG. 4 illustrates a cut path on a part according to one or moreembodiments of the present disclosure.

FIG. 5 illustrates the cut part being removed from the mold according toone or more embodiments of the present disclosure.

FIG. 6 illustrates one example of five axis movement types that can beused according to one or more embodiments of the present disclosure.

FIG. 7 illustrates a method according to one or more embodiments of thepresent disclosure.

DETAILED DESCRIPTION

Laser cutting systems and methods are described herein. For example, oneor more systems include a laser generating component, an opticalcomponent, a fixture for holding a support with a part positioned on thesupport, and a control mechanism for adjusting at least one of the lasergenerating component, the optical component, and the fixture such that aratio of a laser energy applied to the part and a part materialthickness is maintained within a predetermined acceptable range at eachpoint along a cut path to cut through the part while maintaining theintegrity of the support. Other systems and methods are disclosedherein.

Embodiments of the present disclosure can cut through a material forforming a part without cutting into a support material adjacent to thepart material. In some embodiments, the laser beam can cut through thepart material, but not substantially into the support material. In suchinstances, it may provide a part that is cut and is not substantiallymixed with material from the support and/or may allow for reuse of thesupport, if desired.

Embodiments are provided herein that allow for a part to be cut quicklywithout a substantial change to the characteristics of the edge of thepart near the cut path made by the laser beam, such as the brittlenessor discoloration of the part. Embodiments can also cut through materialshaving different thicknesses that are adjacent to a support, among otherbenefits. This can be accomplished by changing one or morecharacteristics of the laser beam as described in more detail below.

In the following detailed description, reference is made to theaccompanying drawings that form a part hereof. The drawings show, by wayof illustration, how one or more embodiments of the disclosure may bepracticed.

FIG. 1 illustrates a system that can be used in accordance with one ormore embodiments of the present disclosure. In the embodimentillustrated in FIG. 1, the system 100 is provided for laser cutting apart from a piece of part material formed over a mold 106.

The system 100 of FIG. 1 includes a laser generating component 102, oneor more optical components 122, a fixture 104, and a mold 106 positionedon the fixture 104. In the embodiment of FIG. 1, the fixture alsoincludes a platform 108 for positioning the mold 106 thereon and arotating mechanism 126 that allows the part to rotate in a clockwiseand/or counterclockwise direction when viewed from above the platform.

In the embodiment of FIG. 1, the system 100 also includes a controlcomponent 110. The control component 110 includes a processor 112,memory 114, and one or more control mechanisms 124, 126, and/or 128.Instructions 116 can be stored in the memory 114 and executed by theprocessor 112 to control, for example, movement of the fixture 104holding the part, movement of the laser generating component 102,movement of one or more of the optical components 122, adjustment of oneor more characteristics of the laser beam generated by the lasergenerating component 102, adjustment of the characteristics of a gasapplied via nozzle 120 and/or other characteristics of a suction appliedvia tube 130.

These items can be controlled, for example, via control components 124,126, and/or 128 and/or via mechanisms provided to adjust one or moreoptical components 122, adjust characteristics of the laser generatingcomponent 102, adjust characteristics of a gas provided via nozzle 120,and/or adjust suction pressure provided via suction tube 130. Memory 114can also have data 118 stored therein that can be used in executing theinstructions as will be discussed in more detail below.

Memory can be a non-transitory machine readable medium that providesvolatile or nonvolatile memory. The memory can also be removable, e.g.,portable memory, or non-removable, e.g., internal memory. For example,the memory can be random access memory (RAM) or read-only memory (ROM).

Memory can, for example, be dynamic random access memory (DRAM),electrically erasable programmable read-only memory (EEPROM), flashmemory, phase change random access memory (PCRAM), compact-diskread-only memory (CD-ROM), a laser disk, a digital versatile disk (DVD)or other optical disk storage, and/or a magnetic medium such as magneticcassettes, tapes, or disks, among other types of memory.

Further, although memory is illustrated as being located in a controlmechanism 110, embodiments of the present disclosure are not so limited.For example, memory can also be located in a memory device that is not acontrol mechanism, but is connected to the control mechanism. In someembodiments, the memory can be internal or external to a computingresource and can enable machine readable instructions to be uploadedand/or downloaded over a network, such as the Internet, or another wiredor wireless connection.

With respect to the control of the laser generating component, theenergy of the laser beam can be controlled in various manners. Forexample, the power to the laser generating component can be adjusted toincrease the energy of the beam created.

For instance, the energy to be applied to the part can be controlledwithin a predetermined range by modulating the power of the laser beam,adjusting an optical component (e.g., one or more mirrors and/orlenses), and/or controlling the speed of the fixture and/or lasergenerating component relative to the fixture based on the partcharacteristics and the desired cutting path. The combination of theseelements can be varied depending upon the characteristics of the systemand/or the characteristics of the materials being cut. For example, ifthe system does not have a laser generating component that is adjustablewith regard to its energy, then the speed of the movement of the fixtureand/or the laser generating component and/or one or more opticalcomponents can be adjusted.

As discussed above, an adjustment that can be made is with respect tothe optical components used. By changing components (e.g., switchinglenses), or adjusting them (e.g., changing the focal length and/ormoving the optical components), the energy generated by the lasergenerating component can be changed as it passes through or is directedby one or more optical components.

These movements can be controlled by the one or more control mechanismsillustrated in FIG. 1 and/or by the executable instructions stored inmemory. For example, a five inch focal length may be used, but it may beadjusted to a shorter or longer length. This focal length can bebeneficial for applications such as cutting dental appliances as itallows for a good amount of variability and can maintain a high enoughlaser energy at focus to adequately vaporize the part material.

The control component 110 can include a fixture control (e.g., softwareand electrical and/or mechanical actuators) that adjusts a speed of thefixture and wherein the control component receives data regarding thepart material thickness, at multiple points along a cut path where thelaser beam will cut the part, and adjusts a speed of movement of thepart past the laser beam based on the thickness data such that the ratioof the laser energy applied to the part and the part material thicknessis maintained within the predetermined acceptable range.

In such embodiments, the ratio can be predetermined or determineddynamically based upon thickness data and/or laser power data takenduring the cutting process. The acceptable range of the ratio is basedon the laser energy needed to cut through the part material withoutcutting into the support material, or in some instances, without cuttinginto the support material to such an extent as to either damage thesupport or facilitate the mixing of support material with the partmaterial.

As used herein, a support material can include material on which itemsare molded, within which items are molded, under which items are molded,or upon which items are positioned after molding, such as a backingmaterial used to hold a part for cutting. The ratio can be determined,for example, based on at least one of one or more part materialcharacteristics and one or more characteristics of a backing material.In some such embodiments, the part, support, and/or backing materialcharacteristics may include at least one of a composition of thematerial and/or the thickness of the material, for example.

In some embodiments, the part material may include multiple parts (e.g.,layer material). For example, the multiple parts may be bonded togetheror adhered together. For instance, the part may include an intermediatelayer (e.g., light adhesive or silicon) between the support (e.g., mold)and the aligner material to allow for the material (e.g., thermal formedmaterial) to shape and cure or be removed after curing. In someembodiments, the intermediate layer can act as a buffer thickness and/orprovide a different reaction to the laser to ensure that only the partmaterial is cut and not the support.

One example of how a ratio may be applied in practice is provided below.With respect to a laser having a 9.3 micron wavelength, set at arepetition rate in the range of 15,000 and 25,000 and having an outputbeam size in the range of 1-4 mm, the laser has a desired output rangeof between 8 and 15 watts because this range of unfocused output powerallows for cutting the part material without discoloring the material byapplying too much laser energy to the support material beneath the part.For example, when using a rapid prototyping material (e.g., SLAmaterial) as a mold material, the interaction of the mold material andthe laser beam can cause the mold material to mix with the partmaterial. In some instances, this may result in discoloration.

The control component 110 can include a laser power adjustment controlthat receives data regarding the part material thickness, at multiplepoints along the cut path where the laser beam will cut the part, andadjusts a power of the laser generating component based on the thicknessdata such that the ratio of the laser energy applied to the part and thepart material thickness is maintained within the predeterminedacceptable range as discussed above.

The control component 110 can include an optics control that adjusts aposition of one or more of the number of optical components where thecontrol component receives data regarding the part material thickness,at multiple points along a cut path where the laser beam will cut thepart, and adjusts a position of the one or more of the number of opticalcomponents based on the thickness data such that the ratio of the laserenergy applied to the part and the part material thickness is maintainedwithin the predetermined acceptable range as discussed above.

A single control component can be utilized to control all of the abovefunctionalities, or these functionalities can be controlled by multiplecomponents (e.g., processors). In some embodiments, the speed of thepart at the cutting position relative to the laser beam at the cuttingposition can be maintained substantially constant while the part ismovable in at least three axes of movement and the power of the laserbeam is controlled within a given range based on information about oneor more characteristics of at least one of the part material, a support,and backing material.

These characteristics can be provided to the processor of the controlcomponent via memory, and/or can be provided by a user via a userinterface in communication with the control component. In variousembodiments, the control component can adjust the speed of the fixturesuch that the laser energy vaporizes all material of the part at eachpoint along the cut path on the part while maintaining the integrity ofthe support.

In some embodiments, the control component for adjusting the laserenergy provides a mechanism for adjusting at least one of lasergenerating component power, laser generating component movement, opticalcomponent type, optical component movement, fixture movement, gas type,gas pressure, gas temperature, and suction such that a ratio of a laserenergy applied to the part and a part material thickness is maintainedwithin a predetermined acceptable range.

In some such embodiments, the laser energy applied to the part thicknessis maintained as the part moves at a constant or substantially constantfeed rate. This can be beneficial in that the laser energy making thecut is generally distributed in an even manner as the laser beamprogresses along the cut path, among other benefits. An example of asubstantially constant feed rate can, for example, be 1000-1500 mm/sec.Another example includes using a 10.6 micron wavelength laser that canrun at 5-10 W and have a constant feed rate of between 1500 and 2000mm/sec. Such a configuration may allow for reduced brittleness at theedge of the cut path, in some applications.

In some embodiments, the laser energy applied to the part thickness ismaintained by increasing the laser generating component power. This canbe beneficial in instances where the speed of the movement of thefixture and/or laser beam cannot be adjusted, among other benefits.

The laser energy applied to the part thickness can be maintained byadjusting the optical component to create a stronger or weaker laserenergy applied to the part, in some embodiments. This can be beneficial,for example, because movement of the optical components can be a morecost effective approach to adjusting the laser energy than otherarrangements, such as movement of the laser and/or fixture, among otherbenefits.

Further, in some embodiments, if the overall power of the laser is lowcompared to its output potential, a beam splitter can be utilized toraise the output percentage of the power generated by the lasergenerating component. This can allow the laser generating component tooperate in a more stable range in relationship to its duty cycle, insome instances. This may increase the durability of the system byoperating the laser in its mid power range (e.g., 40-60%, while deliveryto the cut location may be as low as 10% due to the splitting of thebeam), in some applications. Another benefit of this arrangement can bethe reduction of laser pulsing (i.e., a fluctuation in laser energy)because the laser in not operating at a low power, in some instances.

Additionally, the use of a lower energy with respect to the cut locationcan reduce the presence of several phenomena that cause brittleness. Forexample, reforming the heated part material (i.e., a region next to theedge of the cut that is smooth and shiny due to melting and cooling),mounding or lipping (i.e., a region next to the edge of the cut thatforms a raised smooth and shiny beaded edge), and recasting (i.e., anedge that is rough and has remnants of the molten material as it isblown off its resting point by gas from the gas nozzle, if used).

The control mechanisms that are used to adjust the various components ofthe system can be any suitable mechanisms. For example, they can beelectrical and/or mechanical actuators that move one component withrespect to another component of the system 100. For example, in theembodiment of FIG. 1, control mechanism 128 can be used to move thelaser generating component 102, optical component 122, and gas nozzle120 closer or farther with respect to the platform 108 and therebycloser to or farther from the mold 106.

Such movements can change the characteristics of the laser beamgenerated, how the optics interact with the beam generated, and the gasapplied. In some embodiments, the nozzle 120, optical component 122, andlaser generating component can each be moved independently with respectto each other.

Control mechanism 124 can, for example be a mechanical actuator thatmoves the fixture in a number of directions. For example, in theembodiment of FIG. 1, the mechanism 124 can move the part horizontallywith respect to the laser generating component 102 and can also rotatethe fixture 104 clockwise and/or counterclockwise when viewed from theside of the platform 104 (e.g., from the perspective of the suction tube130 of FIG. 1). In the embodiment of FIG. 1, the combination of themovements of mechanism 124 and those of mechanism 126 allow the fixtureto be moved in five axes of motion with respect to the laser generatingcomponent 102 as will be discussed in more detail below.

In one or more embodiments, the fixture for handling the part can, forexample, include a robot suction and/or pincher mechanism to secureand/or move the support and/or part during the laser cutting process.

As illustrated in FIG. 1, in some embodiments, the system can includeone or more gas nozzles (e.g., nozzle 120) which dispense gas or suckgas in. In various embodiments, the one or more nozzles can be directedat a point at which the laser energy contacts the part. The gas can beany suitable type of gas including chilled, heated, and/or roomtemperature gas (e.g., one type for one nozzle and another type fromanother nozzle). Examples can include air, oxygen, and/or nitrogen,among others.

This can be beneficial for a number of reasons. For example, gas can beused to heat or cool the part, dissipate heat generated from the laser,change the chemical composition of the gas (e.g., air) at the area ofthe cut, and/or suck or blow away debris from the cut path if it is notvaporized from the cutting process, among other benefits.

In various embodiments, the area affected by the heat can be reduceddepending upon the direction in which the gas and laser beam areoriented. For example, area of heat effect may be reduced when the laserbeam is traveling in line with the directed gas and may increase whentraveling across the path of the gas exiting from the tip of the nozzle.

In some embodiments, a nozzle is located at a location remote from thelaser generating component and at an angle to a direction of a laserbeam that directs the laser energy toward the part. Such an embodimentis illustrated in FIG. 1, where the nozzle 120 is oriented at an angleto the laser beam generated by the laser generating component 102. Thiscan be beneficial, in some embodiments, for example, because the gas canbe used to blow away the debris from the cut path area.

Other benefits include: the surface of the cut being improved as well asclouding from the cutting process being reduced through use of blowing agas at moderate velocity. This can, for example, move heavy particlescreated by cutting process away from the cut edge, among other benefits.

Nozzles can have various shapes and sizes based upon the application inwhich it is used. For example, the inner diameter of a nozzle, nozzletip angle, overall angle of a nozzle to the cut location, and nozzle tipshape can be adjusted.

Nozzles can also be oriented in different positions with respect to thecutting location. For instance, a nozzle may be oriented at an angle of32 degrees using a tube with a 1.7 mm inner diameter for debris removal.The tube can be made of brass with the tip compressed into a fan shapeof approximately 1 mm height from the opening, in some embodiments.These characteristics are provided as examples and should not belimiting on the claims herein as other materials, shapes, andorientations can be used in various embodiments.

In some embodiments, the system includes a suction mechanism locatedproximate to where the laser energy contacts the part to remove debriscreated when the laser energy contacts the part. For example, one suchembodiment is illustrated at FIG. 1. This can be beneficial, in someembodiments, for example, because the suction mechanism (e.g., suctiontube 130) can be used to suction away the debris from the cut path area,among other benefits. This can be used in combination with one or morenozzles which, in some instances, can better remove debris from thearea, for example, by blowing the debris toward the suction mechanism.

Another system embodiment includes a laser generating component forproducing a laser beam, a fixture for holding a support with a part tobe cut by the laser beam wherein the part is positioned on the support,an optical component for focusing the laser beam to create apredetermined range of energy at a cut path to cut through the partwhile not substantially cutting the support (maintaining the integrityof the support), and a controller for adjusting a laser energy appliedto the part thickness wherein the controller receives data regarding thepart material thickness, at multiple points along the cut path, andadjusts a ratio of the laser energy applied to the part and a partmaterial thickness to maintain the ratio within a predeterminedacceptable range.

FIG. 2 illustrates a piece of part material being applied over a moldaccording to one or more embodiments of the present disclosure. Withrespect to the scope of the present disclosure, the mold can be in anysuitable shape. For example, in the embodiment illustrated in FIG. 2,the mold 206 is in the shape of a set of teeth of a jaw of a patient tobe treated with a dental aligner appliance.

The part is formed over the mold 206 through use of a sheet of material208. In this instance, the material is a polyurethane material, butother suitable part materials can be utilized for shaping parts on amold.

FIG. 3 illustrates a part being created by forming the piece of partmaterial over at least a portion of the surface mold according to one ormore embodiments of the present disclosure. For example, FIG. 3illustrates the part created from the sheet of material 208 being formedover the mold 206. This method can be performed by a system, such as,for example, system 100 previously described in connection with FIG. 1.

In the embodiment of FIG. 3, the sheet of material 308 has been formedover the mold to create the part 332 (e.g., a dental appliance). FIG. 3also illustrates a cut path 334 where a laser beam has cut the part fromthe sheet of material 308 and a cut path 336 where a feature (e.g., asquare shaped window) of the appliance has been cut into the part 332.

In the dental appliance field, parts may be cut through use of a rotarycutting tool and, as such, cutting along the edge of the part could onlybe done and the resultant cut had rough edges that needed to be polishedby hand or by a polishing process before it could be sent to a patient.Embodiments of the present disclosure allow cuts to be made in otherpositions on the part (e.g., creating a feature such as window 336) andreduce or eliminate the need for post cutting polishing, among otherbenefits.

FIG. 4 is a cutaway top view taken at the cut path illustrating a cutpath on a part according to one or more embodiments of the presentdisclosure. In the embodiment illustrated in FIG. 4, the sheet ofmaterial 432 used to create the part is positioned over the mold 406thereby forming top and side portions that will become the dentalappliance. In this view, a side portion formed adjacent to the sidesurface of the mold is shown. As further illustrated in FIG. 2, the mold206 and 406 is in the shape of a patient's teeth and the resultant partafter trimming the excess material is a dental aligner appliance 532(see FIG. 5). In the embodiment of FIG. 4, a cut path 434 is shown wherethe laser beam has cut the sheet of material 432 a portion of the wayalong the cut path. The hash marked area is representative of the sheetof material below the cut path. In this embodiment, the cut path 434 hasbeen cut through the sheet of material 432, but has not cut into thesurface 438 of the mold 406.

In some applications, such as when a sheet of material is formed on amold, it may change the thickness of some portions of the sheet as itconforms to the mold shape. In such instances, in order to provide anappropriate amount of laser beam energy to cut through the sheet ofmaterial, but not cut the mold material or cut into the mold material ina substantial manner (e.g., the laser energy can be used to cut throughthe part material and into an outer surface of the mold material, butdoes not cut through the mold, thereby maintaining the integrity of themold), the thickness of the material along the cut path can be measuredor estimated (e.g., through virtual modeling of the formation process).

For instance, in some embodiments, a scanning device can be used todynamically (i.e., just prior to and/or as the cutting is taking place)provide the thickness of the part (e.g., sheet material) before it iscut. In various embodiments, a sensor can be used for measuring and/orsensing the thickness of the part along the cutting path 434. The sensorcan, for example, be positioned to measure the thickness of the partalong the cutting path at a position immediately prior to the laser beamcutting the part at that position. Sensors can also be utilized todynamically provide the thickness of the part before it is cut.

If the thickness is estimated, it can be based, for example, on virtualmodeling and/or experiential data stored in memory. In some embodiments,the thickness along the cut path can be determined for each point alongthe cut path, estimated for certain lengths along the cut path (e.g., 1mm line segments) or estimated for the entire length of the cut path. Insome embodiments, the thickness of the part along the cut path has beenpredetermined prior to commencement of the cutting operation virtuallyor by measuring the actual thickness of the part using contact ornon-contact thickness measuring tools. Accordingly, any suitablemeasurement tool can be utilized within the scope of various embodimentsdiscussed herein.

FIG. 5 illustrates the cut part being removed from the mold according toone or more embodiments of the present disclosure. In the embodimentillustrated in FIG. 5, the part 532 has been cut along the cut path 534,the feature 536 has been cut into the part 532, and the part has beenremoved from the mold 506. The mold has not been cut by the laser beamand, therefore, it can be reused, if desired.

FIG. 6 illustrates one example of five axis movement types that can beused according to one or more embodiments of the present disclosure. Inthis illustration, the five axes of motion that are provided in theembodiment of FIG. 1 are illustrated.

For example, control mechanism 128 provides motion in the directions644, control mechanism 124 provides motion in the directions 640 and646, and control mechanism 126 provides motion in the directions 648. Insome embodiments, a control mechanism can be implemented to providemotion in directions 642. This motion could be provided, for example, bycontrol mechanisms 122, 124, and/or 128 or could be provided by anothermechanism not shown.

FIG. 7 illustrates a method according to one or more embodiments of thepresent disclosure. This method can be performed by a system, such as,for example, system 100 previously described in connection with FIG. 1.

In the embodiment of FIG. 7, the method includes creating a virtualversion of a specialized mold and a specialized part positioned on themold, at block 750. In some embodiments, creating the specialized moldfor creating the specialized part to be positioned on the mold includescreating a virtual project development plan or treatment plan whereinthe mold is a representation of a form factor of the mold during thevirtual development or treatment plan. In some embodiments the methodincludes creating a virtual mold based on the virtual treatment plan ordevelopment plan and wherein the multiple part material thicknessestimates for multiple points along the virtual cut path are determinedbased upon analysis of the virtual mold.

Some method embodiments can include creating a number of specializedmolds, each representing a unique part within a respective portion ofthe virtual project development plan or treatment plan. For example,some methods include creating a number of specialized molds where eachspecialized mold represents a unique arrangement of teeth along atreatment plan for incrementally moving teeth. In some embodimentshaving a number of specialized molds, the method includes creatingmultiple virtual molds based on the virtual treatment plan and whereinthe multiple part material thickness estimates for multiple points alongthe virtual cut path are determined for each virtual mold individuallybased upon analysis of each virtual mold.

The method also includes defining a virtual cut path at which a lasergenerating component will direct energy to cut the specialized part, atblock 752. In some embodiments, the method includes defining multiplecut paths wherein one of the multiple cut paths represents a portion ofthe path along a gum line of a patient. Method embodiments can alsoinclude defining multiple cut paths wherein one of the multiple cutpaths represents a cut on the part that is not along a gum line of apatient.

At block 754, the method includes determining multiple part materialthickness estimates for multiple points along the virtual cut path. Themethod also includes defining a set of adjustment instructions foradjusting at least one of the laser generating components, an opticalcomponent, and a fixture that holds the specialized mold such that aratio of a laser energy applied to the part and the part materialthickness is maintained within a predetermined acceptable range at eachpoint along an actual cut path to cut through the part while maintainingthe integrity of the support, at block 756.

In various embodiments having a number of specialized molds, definingthe set of adjustment instructions can include defining a set ofmovement and speed adjustment instructions for each virtual mold. Insome embodiments, defining the set of adjustment instructions includesdefining a set of movement and speed adjustment instructions for movingthe fixture with the part positioned on the mold, wherein theinstructions adjust the speed of movement of the part past the laserbeam based on the determined part material thickness estimates such thatthe ratio of the laser energy applied to the part and the part materialthickness is maintained within the predetermined acceptable range. Insome such embodiments, defining the set of movement and speed adjustmentinstructions can include defining movement and speed of the fixture infive axes in relation to an orientation of the laser generatingcomponent.

These embodiments are described in sufficient detail to enable those ofordinary skill in the art to practice one or more embodiments of thisdisclosure. It is to be understood that other embodiments may beutilized and that process, electrical, and/or structural changes may bemade without departing from the scope of the present disclosure.

As will be appreciated, elements shown in the various embodiments hereincan be added, exchanged, combined, and/or eliminated so as to provide anumber of additional embodiments of the present disclosure. Theproportion and the relative scale of the elements provided in thefigures are intended to illustrate the embodiments of the presentdisclosure, and should not be taken in a limiting sense.

As used herein, “a” or “a number of” something can refer to one or moresuch things. For example, “a number of supports” can refer to one ormore supports.

Although specific embodiments have been illustrated and describedherein, those of ordinary skill in the art will appreciate that anyarrangement calculated to achieve the same techniques can be substitutedfor the specific embodiments shown. This disclosure is intended to coverany and all adaptations or variations of various embodiments of thedisclosure.

It is to be understood that the above description has been made in anillustrative fashion, and not a restrictive one. Combination of theabove embodiments, and other embodiments not specifically describedherein will be apparent to those of skill in the art upon reviewing theabove description.

The scope of the various embodiments of the disclosure includes anyother applications in which the above structures and methods are used.Therefore, the scope of various embodiments of the disclosure should bedetermined with reference to the appended claims, along with the fullrange of equivalents to which such claims are entitled.

In the foregoing Detailed Description, various features are groupedtogether in example embodiments illustrated in the figures for thepurpose of streamlining the disclosure. This method of disclosure is notto be interpreted as reflecting an intention that the embodiments of thedisclosure require more features than are expressly recited in eachclaim.

Rather, as the following claims reflect, inventive subject matter liesin less than all features of a single disclosed embodiment. Thus, thefollowing claims are hereby incorporated into the Detailed Description,with each claim standing on its own as a separate embodiment.

1. A method comprising: providing a mold associated with a virtualtreatment plan for incrementally moving teeth; providing a sheet ofmaterial to be formed over the mold; identifying a cut path for defininga dental appliance associated with the virtual treatment plan;identifying at least one thickness of the sheet of material along thecut path; forming a sheet of material over the mold to create aconformed sheet of material including the dental appliance and excessmaterial to be removed from the conformed sheet of material;formulating, based on the identified at least one thickness of theconformed sheet of material along the cut path, instructions to guide alaser along the defined cut path while maintaining integrity of the moldand while maintaining physical characteristics of the dental appliance;trimming, using the laser, the conformed sheet of material to separatethe formed dental appliance from the excess material along the definedcut path according to the formulated instructions; and removing thedental appliance from the mold.
 2. The method of claim 1, wherein theconformed sheet of material comprises a variable thickness due to theforming of the sheet of material over the mold.
 3. The method of claim1, wherein identifying the at least one thickness of the conformed sheetof material along the identified cut path comprises measuring or sensingthe at least one thickness.
 4. The method of claim 1, whereinidentifying the at least one thickness of the conformed sheet ofmaterial along the defined cut path comprises estimating the at leastone thickness based on a virtual mold associated with the provided mold.5. The method of claim 4, wherein identifying the thickness of theconformed sheet of material along the defined cut path comprisesvirtually modeling the formation process of the conformed sheet ofmaterial over the provided mold, estimating the thickness based onexperiential data stored in memory, or some combination thereof.
 6. Themethod of claim 1, wherein the thickness along the cut paths isdetermined or estimated for each point along the cut path or for certainlengths along the cut path.
 7. The method of claim 6, wherein theformulated instructions maintain a ratio of laser energy applied to thematerial and the identified thickness of the sheet of material along thedefined cut path within a predetermined range at each point along thecut path.
 8. The method of claim 7, wherein the predetermined range ofthe ratio allows the laser to cut through the sheet of material alongthe cut path while maintaining mold integrity and preserving physicalcharacteristics of the dental appliance.
 9. The method of claim 1,wherein the formulated instructions comprise a set of movement and speedadjustment instructions for moving the fixture relative to a lasergenerating component.
 10. The method of claim 1, wherein the mold can bereused after removing the dental appliance from the mold.
 11. A methodcomprising: providing a series of specialized molds, each specializedmold of the series of specialized molds associated with a virtualtreatment plan for incrementally moving teeth; forming a respectiveseries of sheets of material over the series of specialized molds, eachsheet of the series of sheets conforming to respective molds of theseries of specialized molds to create a series of conformed sheets ofmaterial, the series of conformed sheets of material forming arespective series of dental appliances associated with the virtualtreatment plan and a respective series of excess material to be removedfrom the series of conformed sheets of material; for each specializedmold of the series of specialized molds: defining a cut path forremoving the respective excess material from the respective conformedsheet of material; formulating instructions to guide a laser from alaser generating component to cut through the respective conformed sheetof material along the cut path; trimming, using the laser, therespective conformed sheet of material to separate the respective formeddental appliance from the respective excess material along the cut pathaccording to the instructions; and removing the respective dentalappliance from each specialized mold.
 12. The method of claim 11,further comprising determining, for each specialized mold of the seriesof specialized molds, a thickness of the respective conformed sheet ofmaterial along each of the defined cut paths.
 13. The method of claim11, wherein determining, for each specialized mold of the series ofspecialized molds, the thickness of the respective conformed sheet ofmaterial along each of the defined cut paths comprises estimating thethickness based on virtual molds associated with each of the specializedmolds.
 14. The method of claim 13, wherein determining, for eachspecialized mold of the series of specialized molds, the thickness ofthe sheet of material along each of the defined cut paths comprisesestimating the thickness by virtually modeling the forming formationprocess of the sheet of material over each of the specialized moldsand/or estimating the thickness based on experiential data stored inmemory.
 15. The method of claim 11, wherein the adjustment instructionsmaintain a ratio of laser energy applied to the material and thedetermined thickness of the sheet of material along each of the definedcut paths within a predetermined range at each point along the cutpaths.
 16. The method of claim 15, wherein the predetermined range ofthe ratio allows the laser to cut through the sheet of material alongthe cut path while maintaining an integrity of the mold and/ormaintaining physical characteristics of the dental material.
 17. Themethod of claim 11, wherein the adjustment instructions maintain theratio within the predetermined range at each point along the cut pathsby defining a set of movement and speed adjustment instructions formoving the fixture.
 18. The method of claim 11, wherein providing theseries of specialized molds comprises creating a treatment plan,creating a virtual version of each of the specialized molds based on thecreated treatment plan, creating each of the specialized molds based onthe virtual versions of each of the specialized molds; and forming thesheet of material over the specialized molds.
 19. The method of claim11, wherein each of the specialized molds can be reused after removingeach of the dental appliances from each of the specialized molds. 20.The method of manufacturing a trimmed dental appliance, the methodcomprising: creating a treatment plan for incrementally moving teeth;creating a virtual version of a plurality of specialized dentalappliances based on the created treatment plan for incrementally movingteeth; forming at least one of the specialized dental appliances basedon the virtual version of the plurality of specialized dentalappliances; determining, for the at least one specialized dentalappliance, a cut path for trimming excess material from the at least oneformed specialized dental appliances; determining adjustmentinstructions based on the defined cut path for adjusting at least one ofa laser generating component, an optical component, or a fixture thatholds the at least one formed specialized dental appliances of a dentalappliance trimming system to cut through the excess material along thecut path; and trimming, using a laser from the laser generatingcomponent, excess material from the at least one formed specializeddental appliance along the defined cut path using the dental appliancetrimming system and according to the determined adjustment instructionsassociated with the defined cutting path for the at least one formedspecialized dental appliances.